Layer(mass production): 2 to 24 layers.

Max Panel Size: 450*660mm.

Copper Clad Laminate: FR4, FR4(Halogen free), FR5, CEM-1, CEM-3, PTFE, Rogers, Getek,

                                      BT, Polyimide, Al Base, High-TG.

Board Thickness: Min:6mil(0.15mm),

                            Max:280mil(7mm).

Min hole size: Mechanical drilling:8mil(0.2mm),

                       Laser drilling:4mil(0.1mm).

Min line width/space: 3/3mil.

Surface Treatment: Hot Air Leveling, Gold/Nickel Plating, Immersion Gold/Tin/Sliver,

                               Gold Finger, Peeable mask, Carbon Ink, OSP(Entek,F2).